EE Colloquium: Deformable Multimodality Sensors for Biomedicine

Abstract: Recent advances in electronics enable powerful biomedical devices that have greatly reduced therapeutic risks by monitoring vital signals and providing means of treatment.  Conventional electronics today form on the planar surfaces of brittle wafer substrates and are not compatible with the complex body tissues.  Soft and implantable devices can help us better understand the behavior and effects of various diseases.  This talk presents the challenges, design strategies, and novel fabrication processes behind a potential medical device that (a) integrates with human physiology, and (b) dissolves completely after its effective operation.  The integration of the deformable multimodality sensing platform with stretchable antenna, micro-supercapacitor arrays, and energy harvesting modules will yield a self-powered stretchable system for next-generation bio-integrated electronics.

Biography: Dr. Huanyu “Larry” Cheng is an Assistant Professor of Engineering Science and Mechanics with courtesy appointments in the Department of Biomedical Engineering, Department of Mechanical Engineering, and the Department of Materials Science and Engineering at The Pennsylvania State University. His research group focuses on the design, fabrication, and characterization of wearable devices and dissolvable sensors for biomedicine. Larry has co-authored more than 90 peer-reviewed publications with total citations >11,000 and an H-index of 43 according to Google Scholar. His work has been recognized through the reception of awards, including the 2021 Scialog Fellow in Advancing BioImaging, 2021 Frontiers of Materials Award from TMS, First Place in the Ben Franklin TechCelerator Pitch in 2020, a Forbes 30 Under 30 in Science in 2017, among others. He also serves as the (associate) editor for 7 journals and reviewer for 147 international journals.